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(11)Number of the document4261
(21)Number of the applicationa 2011 0044
(22)Filing date of the application2011.05.12
 Date of filing the request for examination (de fond) 12.05.2011
(71)Name(s) of applicant(s), code of the countryINSTITUTIA PUBLICA UNIVERSITATEA DE STAT DIN MOLDOVA, MD; BARANOV Simion, MD; CINIC Boris, MD; GORCEAC Leonid, MD;
(72)Name(s) of inventor(s), code of the countryBARANOV Simion, MD; CINIC Boris, MD; GORCEAC Leonid, MD;
(73)Name(s) of owner(s), code of the countryUNIVERSITATEA DE STAT DIN MOLDOVA, MD; BARANOV Simion, MD; CINIC Boris, MD; GORCEAC Leonid, MD;
(54)Title of the inventionMethod for manufacturing a semiconductor device with relief p-n junction (embodiments)
(13)Kind-of-document code
B1, BOPI 11/2013
A2, BOPI 12/2012
(51)International Patent Classification H01L 21/04 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); H01L 21/302 (2006.01); H01L 21/304 (2006.01); H01L 31/0236 (2006.01); H01L 31/0304 (2006.01);
(19)CountryMD
(41)Date of publication of the application2012.12.31
(45)Date of publication of patent granting decision:2013.11.30
 Substantive examiner(s)SĂU Tatiana, CERNEI Tatiana
 Forfeitures of right up to issuance2015.09.30

18.05.2024